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產(chǎn)品資料

TFP-01,Test Finger Probe (IEC試驗(yàn)指)

TFP-01,Test Finger Probe (IEC試驗(yàn)指),符合: IEC, EN,CSA,UL標(biāo)準(zhǔn).(品牌:美國.ED&D) ULP-02,Articulated Probe with Discs(關(guān)節(jié)試驗(yàn)指),符合UL標(biāo)準(zhǔn).(品牌:美國.ED&D) ULP-02,Articulated Probe with Discs(UL關(guān)節(jié)試驗(yàn)指)

TFP-01,Test Finger Probe (IEC試驗(yàn)指),符合: IEC, EN,CSA,UL標(biāo)準(zhǔn).(品牌:美國.ED&D) ULP-02,Articulated Probe with Discs(關(guān)節(jié)試驗(yàn)指),符合UL標(biāo)準(zhǔn).(品牌:美國.ED&D) ULP-02,Articulated Probe with Discs(UL關(guān)節(jié)試驗(yàn)指)


Model TFP-01: Test Finger Probe(IEC試驗(yàn)指)

This is the “International” test finger required by most IEC, EN and CSA Standards, in addition to many UL Standards. Built in strict accordance to the newest requirements - with integral palm simulator. This is the ONLY Finger Probe available with a integral jack in the handle for continuity testing - as mandated by the IEC CB Scheme. Finger made of chrome plated steel. All parts precision machined.

美國.ED&D產(chǎn)品服務(wù)于:IBM ,美國航空暨太空總署,英代爾,蘋果, NCR ,索尼公司,太陽,飛利浦公司,思科, AT&T , Compaq , JVC , Hewlett-Packard ,摩托羅拉, Mattel ,戴爾,3 Com 等公司;專為UL , CSA , ETL , TUV,Demko等試驗(yàn)室提供檢測產(chǎn)品.

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